...might as well join the Peace Corps… - John "Bluto" Blutarsky1 I would hazard a guess that the majority of people bothering to read an article on electronics cooling likely work in the electronics industry. Moreover, it is probably a pretty good bet that a lot of them have actually taken a class on heat transfer at some point. Since most of us eventually graduated, it … [Read more...]
92ML™ StaCool™ Thermally Enhanced PCB Materials Manage Heat in Power Electronics Applications
Scott D. Kennedy Senior Product Manager Rogers Corp Power Electronics Design Trends Power electronics and associated thermal design is an essential early stage of many product development efforts, especially with growing demand for vehicular and industrial applications. Current trends to increase vehicular driver assistance features, reduce the carbon … [Read more...]
Thermal Management in Consumer-Grade Digital Cameras
The proliferation of digital cameras and their subsequent modular integration in mobile communication and hand-held devices has made today’s photography almost trivial. The latter, i.e., the integration in mobile and hand-held devices is largely made possible by advancements in imaging technology as well as miniaturizing optics and the requisite electronics. Most camera … [Read more...]
Patent Application Review: Integrated Heat Sink and EMI Shield Assembly (US 20160227673)
Editor’s Forward: The ITEM Media team has launched our brand new Electronics Cooling website today! Take a look around – the new layout is responsive with easier navigation and encourages user interaction, with many new features still to come! We are very interested in your feedback, so please use the form below this week’s blog post to log in and post your … [Read more...]
Pluggable Optics Modules – Thermal Specifications: Part 2
By Terence Graham and Bonnie Mack, Ciena Corporation Introduction In Part 1 of this article [1] the overall thermal environment for pluggable optical modules (POMs) was described, with the effect of both out of flatness and source locations relative to heatsink contact area also examined. The article also introduced the relevant sections of the multi-source agreements … [Read more...]
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