By Terence Graham and Bonnie Mack, Ciena Corporation Introduction In Part 1 of this article [1] the overall thermal environment for pluggable optical modules (POMs) was described, with the effect of both out of flatness and source locations relative to heatsink contact area also examined. The article also introduced the relevant sections of the multi-source agreements … [Read more...]
Thermal Facts and Fairy Tales: Fairy Tales About Heat Sink Performance Calculations
Clemens J.M. Lasance, Guest Editor, Philips Research Emeritus, Consultant@SomelikeitCool When Peter Rodgers invited me to again write a Thermal Facts and Fairy Tales (TF&F) column, I immediately thought of a recent webinar on basic heat sink calculations that I attended, in order to get an idea of the current status-quo in these matters. Well, in my humble view there was … [Read more...]
Comparison of Heatsinks used for the Thermal Management of LEDs
By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional heatsinks. However, advances in manufacturing processes and increasing access to simulation tools provide new … [Read more...]
High-Performance Circuit Materials Exhibited at Upcoming Conference
Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally conductive epoxy-based thermoset materials that provide a lead-free-solder-compatible solution for … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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