(July 18, 2016) The complimenting research done by Oak Ridge National Laboratory and the University of Tennessee Knoxville has found a way to improve the heat dissipation in electronics using 3D printing. According to 3DPrint.com, “[Oak Ridge] researchers are showing that 3D printed aluminum may be a more viable source for conducting heat than traditional materials. And at … [Read more...]
Cooling Powerful Electronics with Powerful Sand
(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer for cooling power-hungry electronic devices,” reported Hexus.net. According to Hexus, “the cooling occurs as the result of a … [Read more...]
3D Printed Heat Sink Performs as Well as Conventional Heat Sinks with Annealing Process
(July 8, 2016) Recently, Tong Wu, of the University of Tennessee and Oak Ridge National Laboratory, led a team of researchers who have discovered that manufacturers can create 3D printed heat sinks that can perform as well as conventional heat sinks by employing an annealing process. The research project compared the performance of 3D printed aluminum heat sinks to non-printed … [Read more...]
Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
Pluggable Optics Modules – Thermal Specifications, Part 1
Bonnie Mack and Terence Graham 1. Introduction Pluggable optics modules, (POMs), such as SFP, QSFP, QSFP+, QSFP28, CFP, CFP2, and CFP4 transceivers, are optical interface devices that are connected to a PCB through ports in the faceplate. A brief description of these modules is given in Table 1. Initially conceived as low power devices, the module power density has increased … [Read more...]
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