Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications, THERM-A-GAPTPS60. “THERM-A-GAP TPS60 comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
New High-Performance Thermal Interface Thin Film
Fujipoly recently introduced its new thin film, thermal interface product, Sarcon® YR‐c. The Sarcon® YR‐c effectively eliminates near‐microscopic air gaps that exist between components when placed between a heat source such as a high‐performance semiconductor and a nearby heatsink, said Fujipoly. The Sarcon® YR‐c delivers a thermal conductivity of 4.0 W/m°K with a thermal … [Read more...]
New Smartphone to Use Heat Pipe Cooling
Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology should allow for more sustained boost clocking ad steadier overall performance,” according to ExtremeTech.com. “The other advantage of a heat pipe is that … [Read more...]
Nominations Open for IEEE ITherm Achievement Award
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
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