The world is going with a technical advancement, where electronic items are getting advanced with time. The PCB box build assembly uses multiple circuits on a single track, which takes less space on the board. PCB box build has another terminology that people usually use, which is system integration. The PCB box build process depends on multiple projects, which have variations … [Read more...]
Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
Master Bond MasterSil 153AO is an addition cured two-part silicone with a self-priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. “The key feature of MasterSil 153AO is that it provides the ability to minimize stress, with no compromise on strength. Although it is not considered … [Read more...]
CoolIT Celebrates 20th Anniversary with Revenue Milestone and Strong Market Position
Accelerated Market Adoption of Direct Liquid Cooling and Key Partnerships Lead to Another Bright Year Ahead. CALGARY, Alberta, April 6, 2021 /PRNewswire-PRWeb/ -- CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data centers systems with over 4 million coldplate solutions shipped to date, has reached a significant business … [Read more...]
One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Case Study: Numerical Prediction for Thermal Management of Battery Packs with Cloud-based CFD
Electronics are becoming smaller and smaller and the requirement to dissipate heat is constantly growing. The lack of an efficient thermal management strategy can lead to low performance, energy inefficiency, system failure, and even serious damage. With numerical simulation, such strategies can be tested early in the design process. This article shows how to use this … [Read more...]
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