According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
New Heat Exchange Module Launched
CoolIT Systems (CoolIT), world leader in energy efficient liquid cooling solutions for HPC, Cloud, and Enterprise markets, has expanded its Rack DCLC™ product line with the release of the AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory … [Read more...]
Thermal Live Announces 2017 Thermal Management Product of the Year Winner
Colder Products Company (CPC), the leading provider of quick disconnect couplings, fittings and connectors for plastic tubing, has been awarded Electronics Cooling’s Thermal Live™ 2017 Thermal Management Product of the Year. This award for their LQ2 Series quick disconnect couplings grants CPC prestige and recognition among the thermal management industry and … [Read more...]
Compact Recirculating Chillers Deliver Precise Temperature Control in Laser Systems
Global technology leader Laird has designed a benchtop recirculating chiller for laser applications that require precise and continuous temperature control. The self-contained MRC Series thermoelectric recirculating chiller offers dependable, compact performance by controlling the temperature of a coolant in a liquid circuit. In applications with a cooling capacity requirement … [Read more...]
Avionics Thermal Management of Airborne Electronic Equipment, 50 Years Later
BACKGROUND In a proposal submitted to the Air Force in November of 1968, Collins Radio Company described ways to improve the electronic industry’s understanding of thermal management and predictive techniques [1]. This article briefly describes that proposal and discusses what aspects of electronics cooling have changed over the past five decades and what things have … [Read more...]
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