(August 8, 2016) The minimum efficiency standards for general-purpose, three-phase motors have been raised. “The U.S. Department of Energy (DoE) recently released new efficiency standards for commercial and industrial pumps that are based on efficiency levels negotiated by manufacturers, efficiency advocates, and other stakeholders,” reported MachineDesign.com, “In addition to … [Read more...]
Liquid Cooled Computer Runs Train Safety Big Data Analysis
(July 15, 2016) According to CBROnline.com, the “Institute of Railway Research has chosen a liquid cooled high-performance computer to run railway safety big data risk analysis.” “The HPC called PetaGen 1C, immerses Intel server electronics in a non-flammable liquid coolant in order to provide dedicated computing sources for the IRR’s big data risk analysis research programme … [Read more...]
Tech Brief: Visualization of Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins
Pouya Asrar *, Xuchen Zhang, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei Fedorov, Muhannad S. Bakir, and Yogendra K. Joshi* Introduction Two phase cooling has become a promising technique for managing high heat fluxes from electronic packages such as 3D stacked chips. Flow boiling in microchannel arrays has been employed in many applications[1-3], and boiling … [Read more...]
Liquid Cooled Data Center with More Power and No Leakage
(June 29, 2016) Recently, eBay, Dell, and Intel claimed to have made “major strides in channeling the potential of liquid cooling” to enable greater processing power without excessive consumption “that could have implications for the hyperscale and web services market”, according to EnterpriseTech.com eBay, the world’s largest online marketplace, which handles more than 1 … [Read more...]
Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips
(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to TechRepublic.com, which is “exploring disruptive thermal technologies that will mitigate thermal limitations on the … [Read more...]
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