Pouya Asrar *, Xuchen Zhang, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei Fedorov, Muhannad S. Bakir, and Yogendra K. Joshi* Introduction Two phase cooling has become a promising technique for managing high heat fluxes from electronic packages such as 3D stacked chips. Flow boiling in microchannel arrays has been employed in many applications[1-3], and boiling … [Read more...]
Liquid Cooled Data Center with More Power and No Leakage
(June 29, 2016) Recently, eBay, Dell, and Intel claimed to have made “major strides in channeling the potential of liquid cooling” to enable greater processing power without excessive consumption “that could have implications for the hyperscale and web services market”, according to EnterpriseTech.com eBay, the world’s largest online marketplace, which handles more than 1 … [Read more...]
Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips
(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to TechRepublic.com, which is “exploring disruptive thermal technologies that will mitigate thermal limitations on the … [Read more...]
Sizes Added to Backward-Curved Impeller Line
Rosenberg has recently expanded its high-efficiency E-Series backward-curved impellers to now include sizes from 12.4 to 22 inches with either AC or EC motors. The unique airfoil blade impeller increases energy efficiency by up to 4% and reduces noise by 3 to 5 dB(A). Recommended for computer room air conditioning and air handling (CRAC/CRAH), or energy recovery. … [Read more...]
How to Choose the Right Solution for Effective Heat Management
(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
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