AIR FORCE INQUIRES ABOUT THERMAL MGMT.SOLUTIONS FOR FUTURE AIRCRAFT 8/11/15 - The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research Laboratory at Wright-Patterson Air Force Base, Ohio, issued a broad agency announcement Friday (BAA-AFRL-RQKP-2015-0002) for the Hybrid-Cycle … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Data Center Energy Savings: Total Liquid Cooling Versus Indirect Liquid Cooling
By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible when liquid is supplied to the racks [1]. A solution which has become popular for dense racks is the rear-door water-cooled heat … [Read more...]
Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics
Introduction While data enter energy consumption is already significant, the growth of a global cloud-based economy along with society’s need for constant social networking connectivity will cause this number to rise even further. The world’s Information-Communications-Technologies (ICT) infrastructure, a general representation of cloud-based computing, is estimated to … [Read more...]
New Device to Cool Chips at the Micro-Scale
Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea behind this project is to use liquid, in this case de-ionized water, to absorb the heat produced by any kind of device, then evaporate … [Read more...]
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