Introduction Thermal management of servers and communications equipment has become significantly more challenging over the past several years. As is well known, processor powers have increased to 150 W or more and are projected to continue to rise, despite the move to multi-core designs (and the huge investment in software that this entails) [1]. Rack-level functional density … [Read more...]
Electronics Cooling At Higher Pressures … a Positive Displacement Pump Solution
Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal pumps. The evolution of alternative cooling devices has brought about pressure drop requirements >1.0 bar (14.50 psi) in some cases [1]. These higher … [Read more...]
Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number
Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various industrial and automotive applications. Use of high thermal conductivity metallic nanoparticles (e.g., copper, aluminum, silver, gold, etc.) … [Read more...]
Estimating the effect of intercoolers for computer rack cooling
Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner article addressed the use of a water-cooled air-to-liquid heat exchanger to reduce computer rack air exhaust temperatures and mitigate the effect of … [Read more...]
Cooling Options And Challenges Of High Power Semiconductor Modules
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated Gate Bipolar Transistor (IGBT) modules. The pressure to decrease the size of power electronics systems and, subsequently, the … [Read more...]
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