Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute, which has alarming consequences with regard to thermal management, the installation of modern computer clusters will require … [Read more...]
Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective
In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the form where ρ, k, cp, and � represent the density, thermal conductivity, specific heat (at constant pressure) and dynamic viscosity of the fluid. The … [Read more...]
Exploring the Limits of Air Cooling
Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]
An Overview of Liquid Coolants for Electronics Cooling
Introduction The cooling of electronic parts has become a major challenge in recent times due to the advancements in the design of faster and smaller components. As a result, different cooling technologies have been developed to efficiently remove the heat from these components [1, 2]. The use of a liquid coolant has become attractive due to the higher heat transfer coefficient … [Read more...]
Micropumping Technologies for Electronics Cooling
Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
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