The AIST Group (consisting of National Institute of Advanced Industrial Science and Technology (AIST) and AIST Solutions Co.) and NGK INSULATORS, LTD. (NGK) have embarked on joint research regarding validating methods for evaluating thermal diffusivity of silicon nitride ceramic substrates used for power semiconductor components (power semiconductor modules) and other such … [Read more...]
A New Patented Approach to Diffusion Bonding Offers Speed and Improved Process Control
An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
How Many Ways Can Temperature Affect Performance and Reliability of Electronic Systems?
Thermal management in high performance electronics has become a leading challenge for design and reliability engineers. Harsh temperatures can be caused either by harsh operational conditions (high power dissipation), or by harsh environmental conditions. Both require adequate thermal management to ensure that the product temperature stays within acceptable limits. High … [Read more...]
New Loctite Automotive Potting Solutions Ensure Outstanding Protection from Transmission Fluids, Thermal Shocks
Going the distance: Advanced automotive potting solutions from Henkel maintain electronic components’ performance, durability, and longevity As connected vehicles and autonomous driving functions become increasingly important to the driving experience, the reliability, durability, and performance of the underlying electronic components is fundamental. To ensure this, … [Read more...]
Why Low Gassing Adhesives Matter
The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. When exposed to vacuum or elevated temperatures, conventional adhesives may release volatile compounds, leading to contamination or performance degradation of sensitive components. To mitigate these risks, engineers might consider low … [Read more...]
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