by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
High-Performance Circuit Materials Exhibited at Upcoming Conference
Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally conductive epoxy-based thermoset materials that provide a lead-free-solder-compatible solution for … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
New Epoxy Ideal for High Vacuum Environments
Master Bond has released their new two part epoxy, EP30AN-1. EP30AN-1 is ideal for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and NASA low outgassing approval. It offers superb dimensional stability and superior physical strength properties. EP30AN-1 is also an excellent adhesive and sealant forming durable, rigid … [Read more...]
Thermal Conductivity & CTE of Materials: Can We Engineer Them?
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Most electronics cooling problems are not just limited to the computation of temperatures at various points and the design remedies thereof. They also extend to managing the collateral effects of temperature fluctuations. One such effect is the mobilization of thermomechanical stresses in … [Read more...]
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