(July 21, 2016) Recently, with the use of some everyday materials, researchers discovered a breakthrough that would allow quantum computing at room temperature. “A long conduction electron spin lifetime in metallic-like material made up of carbon nanospheres […] was produced simply by burning naphthalene, the active ingredient in mothballs,” reported TheConversation.com. “The … [Read more...]
Cooling Powerful Electronics with Powerful Sand
(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer for cooling power-hungry electronic devices,” reported Hexus.net. According to Hexus, “the cooling occurs as the result of a … [Read more...]
Application of Phase Change Materials in Handheld Computing Devices
William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are excellent candidates for use of phase change materials (PCMs). Processor loads in handheld products are highly variable. There … [Read more...]
Thermal Expansion Discovery Could Lead to More Durable Electronics
(June 27, 2016) Standford professor of materials science and engineering, Reinhold Dauskardt, and doctoral candidate Joseph Burg, recently released a study revealing that the layers protecting transistors in chips respond differently to compression and tension of bending and stretching. “It has always been assumed that these dense insulating materials react exactly the same … [Read more...]
Special Adhesives to Better Medical Equipment
(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology. MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate the need for clamping” for “interconnects, grounding and shielding applications in medical … [Read more...]
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