Master Bond’s MasterSil 972TC-LO, a high temperature resistant, thermally conductive system, now meets the requirements for low outgassing per ASTM E595 specifications. “MasterSil 972TC-LO is an insulator that has a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)]. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, … [Read more...]
New Adhesive Materials with Jet Dispense and Snap Cure Abilities
Recently, Techsil announced new jettable conductive adhesives with improved conductivity. According to Techsil, these adhesive materials have a high speed production because of their Jet dispense and snap cure abilities. “The new Elecolit® silver filled adhesives are both electrically and thermally conductive and available in a range of viscosities,” according to the … [Read more...]
New Medical-grade Silver-Silver Chloride Ink and Coating for Sensors
Creative Materials, Inc. has recently presented 113-09(S), a new medical-grade silver-silver chloride (Ag-AgCl) ink and coating for sensors, ECG, EEG, TENS and defibrillator electrodes. According to Creative Materials, 113-09(S) is chemical-resistant and designed with aging characteristics when used with high salt content hydrogels. In addition, 113-09(S) has adhesion to … [Read more...]
New Option for LCD to Printed Circuit Board Connections
Fujipoly recently introduced the Series 5002 Silver Zebra connector. The connector is a low-cost, long-life option for LCD to printed circuit board connections, and can be used as a board to board connector where space is limited. It has a “carrying capacity up to 300 mA per square .040”and exhibits a contact resistance of less than 500 mΩ,” Fujipoly said. The Series 5002 … [Read more...]
Thermoplastically Deformable Electronic Circuits to Improve LEDs
This week, at the Meeting of the International Microelectronics Assembly and Packaging Society (IMAPS 2015), CMST and imec (a lab at Ghent University) will present a new thermoplastically deformable electronic circuit. This circuit enables low cost 2.5D free-form rigid electronic objects. These circuits are currently being tested to determine its potential to improve LED … [Read more...]
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