Master Bond Inc. introduces the Master Bond EP21NDCL - a new two component non-drip epoxy paste that cures optically clear in thin sections. It is ideal for bonding, coating and sealing applications in aerospace, electrical, opto-electronic and specialty OEM industries. The Master Bond EP21NDCL bonds well to plastics, rubbers, glass, metals, ceramics and other materials and it … [Read more...]
Metal Organic Frameworks Applied in Layers Could Signal Cooling Revolution
Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined by research published in RSC Advances, are three-dimensional porous structures consisting of metallic clusters and organic linkers adept … [Read more...]
New Magnetocaloric Material Could Lead to Greener Refrigerators
The recent discovery of a new magnetocaloric material with intriguing characteristics could lead to a greener method of cooling, potentially providing a more environmentally-friendly alternative to standard refrigeration. A joint team of researchers from Canada and Bulgaria have developed a new method of green cooling by identifying a multiferroic compound, HoMn2O5, that could … [Read more...]
Adhesive Cures at Temperatures as Low as 60°C
DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging and other applications where … [Read more...]
Thermal Adhesive Tape Reduces PCB Production Time
Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the PCBs to be finished/ supplied with a thermally conductive, mechanical fixing tape pre-applied and thus reducing … [Read more...]
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