On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
Researchers Developing New Thermoelectric Materials
New technology from researchers at the University of Houston has the potential to increase vehicle mileage by five percent and power plant and industrial processing performance by as much as 10 percent. The breakthrough combines tin telluride and chemical element indium in a material that can capture waste heat and convert it into electricity. According to Zhifeng Ren, M.D. … [Read more...]
Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
R. Shrestha, K. M. Lee and T. Y. Choi - University of North Texas D. S. Kim - POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity measurement of thin films, accurate measurement of such materials has been difficult to achieve for thicknesses less than 1 µm. For example, conventional Fourier heater plate … [Read more...]
Multi-Purpose Cold Plates for TEC, LED and Semiconductor Cooling
Custom liquid cooling solutions provider Koolance has released three new multi-purpose cold plates for heat sources ranging from 25-50 mm/sq. The three models— PLT-UN50F, PLT-UN40F and PLT-UN25F—are ideal for thermal applications such as thermoelectric cooling, LEDs, image sensors and semiconductor cooling. PLT-UN50F features a cooling area footprint of 50mm x 50mm (1.97in x … [Read more...]
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