Engineered Material Systems, a supplier of electronic materials for circuit assembly applications, has released its CA-195 high thermal conductivity LED die attach adhesive for bonding LED and other small semiconductor die to silver and copper lead frames. According to the company, CA-195 is approximately half the cost of a pure silver-filled die attach adhesive and features a … [Read more...]
Clay is Key Ingredient in High-Temperature Supercapacitors, Say Researchers
Clay, an abundant natural material, may hold the answer to developing super high-temperature supercapacitors for powering devices in extreme environments, says new research from Rice University. According to a report released in Nature’s online journal, Scientific Reports, the supercapacitor created by researchers at Rice University using naturally-occurring clay and room … [Read more...]
NASA Selects Proposals for Future Spacecraft Thermal Control Systems
NASA has selected eight proposals to develop advanced thermal control system technologies for future spacecraft as part of its Game Changing Development Program (GCD). The program was created to investigate novel ideals and approaches to protect spacecraft and the astronauts within while enabling them to remain in space for longer periods of time. The selected proposals will … [Read more...]
Advanced Carbon-Based Thermal Management Materials and Applications Webinar
On September 25, 2013 at 1:00 p.m. (EDT), Carl Zweben will present a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. … [Read more...]
New Multi-Tasking Robot Platform for Thermal Grease Dispensing Applications
Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT circuit boards to larger PCBs and finished assemblies. Ideal for precision form-in-place gaskets, encapsulation, coating, EMI and thermal grease applications, underfill and … [Read more...]
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