On September 25, 2013 at 1:00 p.m. (EDT), Carl Zweben will present a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. … [Read more...]
New Multi-Tasking Robot Platform for Thermal Grease Dispensing Applications
Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT circuit boards to larger PCBs and finished assemblies. Ideal for precision form-in-place gaskets, encapsulation, coating, EMI and thermal grease applications, underfill and … [Read more...]
B-Staged Adhesive Film for Bonding and Sealing Applications
A new high temperature-resistant B-staged adhesive film is available from Master Bond for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. FLM36 film adhesive can withstand temperatures up to 500°F, offers good electrical insulation, and retains its high strength properties upon prolonged exposure to elevated … [Read more...]
Thermal Pads Enhance LED/Luminaire Performance
Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes … [Read more...]
Thermal Adhesive Tape for Application to Unprocessed PCBs
Thermal management materials manufacturer Universal Science has introduced a new thermal adhesive tape designed to be applied to FR4 or insulated metal substrate printed circuit boards (PCBs) prior to processing as a replacement for mechanical fixings. Featuring a thermal conductivity of 2.0 W/mK and a breakdown voltage (electrical isolation) of 4 kV AC, Bondline 2000-REFLOW … [Read more...]
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