Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated … [Read more...]
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The use of flexible, cost-efficient microchips as a replacement for silicon chips, which are more expensive and difficult to make, is … [Read more...]
Ellsworth Adhesives Sales Representatives Awarded 2012 Gold and Bronze Sellers of the Year Awards
Ellsworth Adhesives, a distributor of adhesives and specialty chemicals, has been recognized by Dow Corning Corporation for top performance in 2012. Ellsworth Adhesives’ Engineering Sales Representatives Ron Cormier (Northern California) and Sergio Ramirez (Mexico) have been awarded the 2012 Gold and Bronze Sellers of the Year, respectively. “We are thrilled for our team to … [Read more...]
Dispensable Thermal Pads for Thermal Management in LED Lighting Applications
Dow Corning, a developer of silicone-based technology, has announced new dispensable thermal pads developed for more cost-effective thermal management in LED lighting applications. Dow Corning’s new product line of dispensable thermal pads features four grades “distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses.” Dow … [Read more...]
New Method Combines Gallium Nitride and Diamond for Better Thermal Management of Amplifiers
A demonstration of what is considered to be the first-ever gallium nitride (GaN)-on-diamond high electron mobility transistor could significantly reduce thermal resistance and increase RF performance in monolithic microwave integrated circuit (MMIC) power amplifiers, DARPA said in a statement. While MMIC power amplifiers equipped with gallium nitride transistors hold the … [Read more...]
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