Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and commercialize next-generation, multiphase thermal management systems for electric vehicle (EV) battery and light emitting diode (LED) … [Read more...]
Scientists Answer Mystery Regarding How Bi2Te3 and GaAs Are Combined, Opening Door for More Efficient Cooling Technologies
While researchers have long known that thin films of bismuth telluride (Bi2Te3)—which converts heat into electricity or electricity into cooling—can be combined on top of a gallium arsenide (GaAs) foundation to create cooling devices for electronics, a team from North Carolina State University (NCSU) and RTI International have answered the question as to how they are combined … [Read more...]
Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic thermal interface pads provide “good softness and conformability to non-flat surfaces [and] excellent compressive stress … [Read more...]
Heat Transfer at 'Any Temperature' Makes Thermal Interface Film Suitable for Cold Plate Applications
Thermal interface material developer AOS Thermal Compounds recently released Micro-Faze, a thermal interface film formulated with non-silicon thermal grease. According to AOS Thermal Compounds, Micro-Faze “requires minimum force to achieve total interface contact” and “Retains all the performance advantages of thermal grease . . . in the form of a thermal pad.” Suited for cold … [Read more...]
Low-Viscosity Thermally Conductive Silicone Compound
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
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