German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
New Silicone-Based Material May Increase Computer Speeds without Increasing Energy Consumption, Heat
Scientists from Dow Corning Electronic and IBM have developed a new high-performance, silicone-based material that could replace copper in waveguides and enable supercomputers to use energy more efficiently while simultaneously allowing for an increase computing speeds. Developing a method for increasing computer speeds without increasing energy consumption, and therefore heat, … [Read more...]
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and … [Read more...]
Thermal Gap Fillers Feature High Performance, Low Contact Resistance
Laird Technologies, Inc., a designer of customized performance-critical components and systems for advanced electronics and wireless products, has announced the release of Tflex SF800 and Tflex SF200, two new Tflex series thermal gap fillers. According to the company, “Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features … [Read more...]
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