Laird Technologies, Inc., a designer of customized performance-critical components and systems for advanced electronics and wireless products, has announced the release of Tflex SF800 and Tflex SF200, two new Tflex series thermal gap fillers. According to the company, “Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features … [Read more...]
Researchers Enhance Thermoelectric Device Efficiency with Embedded Nanoparticles
Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The new method may have the potential to widen the use of thermoelectric devices. In cooperation with graduate student … [Read more...]
New Silicone Potting and Encapsulating Compound for Rapid Thermal Transfer
Epoxies, Etc., a manufacturer of thermal management compounds, epoxies and adhesives, has released a new silicone potting and encapsulating compound. According to the company, the 50-1952 is formulated for rapid thermal transfer away from heat-generating electronic devices. The new silicone compound is made of flexible material to protect electronics from vibration and impact … [Read more...]
Nanotechnology Copper-Based Solder Material for Applications in Military and Commercial Systems
Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the company, the creation of the new solder material is a result of an ongoing effort to phase out … [Read more...]
New Porous Metal Technology for Thermal Management in Electronic Components
U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil Ricketts began collaborating with researchers at the University of Liverpool to examine the use of porous metals for strength-to-weight ratio … [Read more...]
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