Many engineers have traditionally designed bonding applications to withstand extreme temperatures using the idea that substrate materials and adhesives with similar coefficients of thermal expansion (CTE) will, at a given temperature, change size at the same rate. However, the difficulty of finding substrates and adhesives that have compatible CTEs and meet all application … [Read more...]

A research team at the University of Illinois as Urbana-Champaign (UIUC) has developed a new system for examining and measuring nanoscale thermal conductance at the interface between two materials. The scientists believe that with further refinement, the system can be used to harvest electricity from waste heat, increase cooling efficiency of microelectronic devices and target … [Read more...]