Aremco Products, Inc., a developer of technical ceramics, adhesives, coatings and sealants, has released Aremco-Bond™ 860, a thermally conductive epoxy system developed for bonding heat sinks and fins used in heat exchangers and electronic assemblies. Aremco-Bond™ 860 is comprised of a ratio of one-part base resin to one-part activator by weight and can be used for … [Read more...]
Semiconductors Grown on Graphene May Change Industry
CrayoNano AS, in cooperation with the Norwegian University of Science and Technology (NTNU), has introduced GaAs nanowires grown on graphene, a patented hybrid material with competitive properties. The patented method of growing semiconductor nanowires on atomically thin graphene uses MBE (Molecular Beam Epitaxy) to grow the nanowires and offers excellent optoelectronic … [Read more...]
Standard Defines Requirements for PE Substrates
IPC, the Association Connecting Electronics Industries, has published standards to promote development in the Printed Electronics industry. IPC-4921, Requirements for Printed Electronics Base Materials (Substrates), defines terms and sets out basic requirements within the industry to help it expand more quickly. The standard addresses five basic material categories for … [Read more...]
Liquid Dispensed Thermal Interface Material Filler
The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for flexibility in component orientation during assembly. As cured, the soft elastomer provides a … [Read more...]
New Family of Highly Thermally-Conductive Bonding Materials
Applied Nanotech Holdings, Inc. has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND™ for power electronics and photonics applications. THERCOBOND™ materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal … [Read more...]
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