Multiple layers of graphene show strong heat conducting properties that can be harnessed in removing dissipated heat from electronic devices, a team of scientists from the University of California reported in a recently published paper in the journal Nature Materials. Having previously shown that graphene — a two-dimensional layer of carbon atoms packed in a honeycomb structure … [Read more...]
Thermoelectricity: Turning Temperature Differences Directly into Electricity
The fundamental problem in creating efficient thermoelectric materials is that they need to be good at conducting electricity, but not at conducting thermal energy, say Massachusetts Institute of Technology (MIT) researchers. That way, one side can get hot while the other gets cold, instead of the material quickly equalizing the temperature. But in most materials, electrical … [Read more...]
High-Performance Thermal Putty
Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al is manufactured with a thin aluminum carrier film for customer-friendly application. The low adhesion aluminum barrier … [Read more...]
Study: Carbon Nanotubes Could be Used for New Energy Systems
A team of scientists at Massachusetts Institute of Technology have discovered a previously unknown phenomenon that can cause powerful waves of energy to shoot through minuscule wires known as carbon nanotubes. The discovery could lead to a new way of producing electricity, the researchers say. The phenomenon, described as thermopower waves, is such a new discovery that it’s … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
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