Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1]. Unless advanced thermal interface materials (TIMs) that achieve order-of-magnitude improvements in performance quickly emerge in the … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
Firms partner for manufacture of SynJet thermal management solutions
Nuventix, Inc., innovator of SynJet® active thermal management solutions, has signed a Manufacturing Services Agreement with Nypro Inc., which provides plastic injection molding and turn-key assembly of Nuventix products. Under the terms of the agreement, Nypro will perform new product introduction and manufacturing services for Nuventix. Nypro will provide development and … [Read more...]
Technical Data Summary
ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging and as a result, this column will evolve into additional topics. … [Read more...]
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
- « Previous Page
- 1
- …
- 61
- 62
- 63
- 64
- 65
- …
- 84
- Next Page »
