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Thermal Strain In Semiconductor Packages, Part I

 

Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]

About viscosity

 

Table 1. Dynamic Viscosity Values for Various Gases and Liquids When we look at a fluid parcel subject to a velocity gradient in the direction perpendicular to the direction of the flow, we observe that this fluid parcel deforms. This type of deformation is called shear. The ability to withstand shear is a material property called the dynamic viscosity m. The viscosity … [Read more...]

Moisture permeation in electronics

 

Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since the movement of heat and moisture are similar (i.e., diffusive), thermal engineers may be … [Read more...]

Thermal Challenges In LED Cooling

 

Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting fields, LEDs have become one of the standard methods of producing light, joining more traditional sources such as incandescent, fluorescent and … [Read more...]

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