Introduction In the past few decades, as microprocessors have continued to evolve along Moore's law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in raw power and in local power densities on the die, commonly referred to as "hot spots"[1, 2]. Considerable attention has therefore been given … [Read more...]

It doesn't take long for an electronics assembler to realize that a thermal interface material (TIM) is essential when two or more solid surfaces are in the heat path. Standard machined surfaces are rough and wavy, leading to relatively few actual contact points between surfaces. The insulating air gaps created by multiple voids of "contacting" hard surfaces are simply too … [Read more...]