Continuing our discussion of different forms of carbon, this column addresses the topic of pyrolytic graphite, a material that opens up many interesting applications not only for cooling but also for scientific measurement equipment. Pyrolytic graphite - the finest forms of which are often called Highly Ordered Pyrolytic Graphite (HOPG) - is manufactured through a pyrolysis … [Read more...]
Thermal joint conductance for graphite materials
The heat flow across a metal/interstitial elastic-layer/metal joint is a very important problem in many microelectronic applications. It is generally known that when two surfaces are brought together, intimate solid-to-solid contact occurs only at discrete parts of the interface. Therefore, the actual contact area of pressed surfaces represents a very small fraction of the … [Read more...]
Flash Diffusivity Method: A Survey of Capabilities
The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing cooling requirements that result from the packaging of higher performance devices. A variety of methods, involving … [Read more...]
The Thermal Conductivity of Thermal Insulators
This issue, we present an overview of a number of materials that are often used as thermal insulators. The world would have been much easier for thermal engineers if only the creator had provided us with a choice of materials showing the same range in thermal conductivity values as exists for electrical conductivity. Alas, this isn't the case. Thus, not a single one of the … [Read more...]
Understanding Phase Change Materials
Although phase change materials (PCM) were introduced nearly twenty years ago, it was not until the development of the high-powered Pentium processor that this class of interface material gained widespread acceptance. The large quantities of heat produced by these processors necessitated a carefully designed thermal path where all of the thermal resistances were minimized. For … [Read more...]
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