This time, the focus is on the thermal conductivity of unfilled plastics. There are hundreds of them, so only a small selection can be presented. From a thermal point of view, plastics are a notoriously difficult family. Different sources show large variations in the thermal conductivity, and handbooks provide a range of values for many materials instead of a single value. The … [Read more...]
Visualization of air flows in electronics systems
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple shapes, such as cubical metal blocks simulating electronic components, often exhibit multi-dimensional flow phenomena that include … [Read more...]
Future trends in heat sink design
In today's electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled, can significantly shorten the life of the electronics. Although this "increased power - decreased size" scenario has been prevalent for … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
High accuracy thermal interface resistance measurement using a transient method
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board becomes the next limiting factor. Therefore, understanding interface and contact resistances becomes increasingly important for … [Read more...]
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