Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a result of the steady state powering or the time dependence of the temperature increase or decrease in case of transient qualification. From these data, … [Read more...]
The thermal conductivity of fluids
About 10-15 years ago, fluids, either directly (mainly Fluorocarbons), or indirectly (cold plates flushed with water) cooled the majority of mainframe computers. Nowadays, the expected increase in heat flux density causes a renewed interest in either passive or active liquid cooling, because the limits of air cooling come within reach. Other practical applications in which … [Read more...]
A system level cooling solution for cellular phone applications
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products requires innovative solutions to improve device thermal performance. The primary cooling path in portable electronics serves … [Read more...]
How Thermal Conductivity Relates to Electrical Conductivity
Because the accurate determination of thermal conductivity is a demanding task (often not recognized by either designers or vendors), methods, based on the measurement of another physical property that is uniquely coupled to thermal conductivity, are very challenging. One such method is based on the so-called Wiedemann-Franz Law, which links the thermal conductivity to the … [Read more...]
Computer-related thermal packaging at the millenial divide
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as a key enabling technology in the development of advanced microelectronic systems and has facilitated many of the "Moore's Law" [Moore, G.E., 1975] … [Read more...]
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