Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is straightforward. However, the difficulty lies in making an accurate case temperature, Tc, without affecting the junction temperature, Tj, and the … [Read more...]
Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package
Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
Scientists Achieve First Measurement of Moly’s Thermal Conductivity
Scientists at the National Institute of Standards and Technology’s Physical Measurement Laboratory have succeeded in measuring the thermal conductivity for the first time of an ultra-thin material that is expected to play a major role in the developing field of nanoelectronics. Molybdenum disulfide, also known as molybdenite or “moly” for short, is a 2D material that measures … [Read more...]
New Thermoelectric Material May Boost Development of Green Technologies
New material properties discovered by researchers at the University of Miami may impact ongoing research into thermoelectric materials, which are useful in power generation, energy detection and refrigeration and cooling. Lead author Joshua Cohn, professor and chairman of the UM Department of Physics, and his colleagues report new properties of a metal known as lithium … [Read more...]
New TIM Boosts Performance Over Thermal Greases
Indium Corporation has announced the release of its new Heat-Spring® thermal interface material, which was featured at PCIM this month in Nuremberg, Germany. Heat-Spring is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs offer uniform thermal resistance at lower applied stresses in compressed … [Read more...]
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