EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom equipment, computers, security equipment and other electronics and electrical devices housed in … [Read more...]
Bergquist Talks TIMs at Semi-Therm 30
Form-in-Place Thermal Compound for Delicate or Low Compression Requirements
Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low compression requirements. According to the company, the new thermal compound will not cause corrosion on metal surfaces and … [Read more...]
SEMI-THERM 30 Media
Photos Videos Colder Products Company Discusses New Products at SEMI-THERM 30. The Bergquist Company Discusses Products at SEMI-THERM 30. … [Read more...]
Graphene Improves Copper Film Thermal Conductivity
The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according to new research from scientists at the University of Manchester, UK and the University of California-Riverside, U.S. The phenomenon was … [Read more...]
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