Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
Top 10 FloTHERM V10 Features – #1: New GUI
FloTHERM V10 is a major release that marks 25 years as the leading electronics thermal simulation tool. This series will introduce the top 10 features that we’ve delivered, hopefully giving some insights not just on the features themselves, but also on the background as to how and why we’ve developed them. To start with let’s look at the most obvious change, a … [Read more...]
Cooling Fans and Accessories Protect Critical Components
NTE Electronics has released a new line of cooling fans and accessories to protect critical electronic components from premature failure due to heat. Available in five different sizes—40x40mm, 60x60mm, 80x80mm, 92x92mm and 120x120mm—the new AC and DC fans from NTE Electronics utilize a propeller to create a large airflow in the direction of the axis, moving the air in a … [Read more...]
Fansinks for High Temperature Applications
CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to 90°C, calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to fit different applications. The FHS series is … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
- « Previous Page
- 1
- …
- 135
- 136
- 137
- 138
- 139
- …
- 355
- Next Page »
