A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared to traditional air cooling methods, liquid cooling is commonly used in a number of applications such as internal combustion engines in vehicles and … [Read more...]
Sony Releases Source Code for Thermal Management Solution
Consumer electronics provider Sony has released the source code for Thermanager, a thermal management solution developed for and used in the company’s Android Open Source Project (AOSP) for Xperia projects. The source code is available through the Sony channel on GitHub. “Since the first release of Android Open Source Project (AOSP) for Xperia devices, thermal management for … [Read more...]
Waterproof Tablet Computer Features Cooling Fan
Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that can be used both as a clamshell notebook computer and as a tablet computer when the display unit is detached. The casing houses an Intel Core … [Read more...]
Nanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers
Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company, the increase in thermal conductivity is achieved without affecting the electrical insulation or other mechanical … [Read more...]
Thermal Connectors Improve PCB Assembly Heat Dissipation
TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal conductivity compared to traditional PCB heat spreading methods by allowing heat to dissipate more … [Read more...]
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