TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal conductivity compared to traditional PCB heat spreading methods by allowing heat to dissipate more … [Read more...]
New Low-Thermal Resistance Gap Filler Pad
Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. According to the company, the material’s new formulation dramatically reduces material tearing and damage during assembly and rework operations and improves cooling performance by filling unwanted air gaps between board components and … [Read more...]
Patent Awarded for Free Cooling Solution for a Containerized Data Center
The U.S. Patent and Trademark Office has awarded patent No. 8,554,390, “Free Cooling Solution for a Containerized Data Center,” to the International Business Machines Corporation in Armonk, N.Y., USA. “There is a problem in that the cost of operating today's data centers continues to rise and come under closer and closer scrutiny,” the inventors explain in their summary. … [Read more...]
Wind Tunnel for Thermal and Airflow Testing of Multiple PCBs
Omega Engineering has released the new WT-3200 series of wind tunnels for thermal and airflow testing of multiple PCBs. Featuring a 2-D converging nozzle with a multi-point measurement area for sensor placement upstream of the test section, the test chamber can accommodate up to six PCBs with 13 mm (0.5 in) card-to-card spacing or three PCBs with 25 mm (1 in) card-to-card … [Read more...]
‘Electronic Blood’ Powers and Cools Brain-Inspired Computer
IBM has unveiled a prototype of a new brain-inspired computer powered and cooled by what the company is calling “electronic blood.” The company says it is learning from nature in an effort to develop small, highly efficient computing systems. "We want to fit a supercomputer inside a sugar cube," IBM researcher Bruno Michel, Ph.D., told the BBC. He and co-researcher Patrich … [Read more...]
- « Previous Page
- 1
- …
- 145
- 146
- 147
- 148
- 149
- …
- 356
- Next Page »
