Military and aerospace component manufacturer AMETEK Rotron has released the MIL-XTM Extreme Performance series, a tubeaxial cooling and ventilation fan series with the highest performance in the industry for its package size, according to the company. With significant advances in aerodynamics, motor and DC drive, says the company, the new fan maintains ruggedness and … [Read more...]
New Online Cooling Fan Visual Selection Tool
NMB Technologies Corporation has announced the availability of a new online tool for the quick selection of NMB cooling fans. The new Visual Fan Selector includes NMB's DC and AC axial cooling fans, impellers and blowers and is completely dynamic, allowing the engineer to quickly select the cooling fan that best benefits their application. The selector contains the complete … [Read more...]
Thermally Conductive Adhesives for Use with Automotive Electronics
Dow Corning has announced the release of two new thermally conductive adhesives, Dow Corning TC-2030 and Dow Corning TC-2035, for use with automotive electronics assemblies. The announcement was made today at Bondexpo in Stuttgart, Germany. “It’s no understatement to say that the growth of automotive electronics is booming, resulting in unrelenting pressure on automotive … [Read more...]
New Micro-Controlled DC Fans
Fan manufacturer JMC Products has released the Edison micro-controlled “intelligent” DC fan that offers efficient power consumption, various alarms and speed feedback. In addition to standard micro-control benefits, says the company, the new Edison Fan also includes closed loop PWM (pulse width modulation) speed control, enabling the fan to maintain its PWN to RPM relationship … [Read more...]
Patent Covers Methods of Making, Cooling Semiconductor Packages
The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
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