From the International Electrotechnical Commission Webstore: “IEC 62610-4:2013 specifies the test setup and test parameters for water-supplied heat exchangers within single electronic cabinet configurations. The tests are focused on cabinets for the installation of high power dissipation electronic equipment. The cabinets concerned are from the IEC 60297 (19 in) and IEC 60917 … [Read more...]
New Manufacturing Method Increases Heat Sink Thermal Efficiency
A new method of manufacturing high ratio air-cooled extruded aluminum heat sinks has been announced by Sapa Extrusions North America. The extruded aluminum products manufacturer claims that heat sinks created using the new method are approximately eight percent more thermally efficient than the industry standard. “The patent-pending method utilizes a modular concept that … [Read more...]
Mobile CPU Cooler for Industrial PCs
A new mobile CPU cooler for industrial PCs has been released by Taiwan-based thermal and metal products manufacturer FZtech. According to the company, the Freezer 200 cooler is available with a two ball bearing, and users have the option of including pulse-width modulation capabilities in their CPU cooler “in order to optimize cooling with fan speed changing automatically, … [Read more...]
B-Staged Adhesive Film for Bonding and Sealing Applications
A new high temperature-resistant B-staged adhesive film is available from Master Bond for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. FLM36 film adhesive can withstand temperatures up to 500°F, offers good electrical insulation, and retains its high strength properties upon prolonged exposure to elevated … [Read more...]
Thermal Pads Enhance LED/Luminaire Performance
Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes … [Read more...]
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