New research from MIT that identifies the key attribute in surface dissipation of heat could lead to improved power plant efficiency and better cooling of high-power electronics. A team of MIT researchers has reportedly completed what they claim is the first systematic investigation of the factors that control boiling heat transfer from a surface to a liquid, a process that is … [Read more...]
Discovery Could Change Textbook Models on Heat Transfer
A new discovery in the physics of heat transmission along nanowires could rewrite the models of heat transfer in current textbooks and bring major changes to the electronics industry. Researchers at the National Taiwan University’s Center for Condensed Matter reportedly found ballistic thermal conduction by phonons at room temperature along silicon-germanium nanowires. While … [Read more...]
Data Center Coolant Distribution System
Rittal Corporation, a manufacturer of industrial and IT enclosures, racks and accessories, has released a new coolant distribution system for use with Rittal’s rack- or door-mounted liquid cooling packages (LCP). Designed to handle all water routed between adjacent chillers and rack- or door-mounted LCPs, the new distribution unit is available with either four- and eight-tap … [Read more...]
Phase-Change Material Offers Alternative Thermal Management Solution to Thermal Grease
Universal Science, a manufacturer of thermal management materials, has introduced UniPhase 3500, a new phase change material that combines a high level of thermal performance and a thin bond line into an ideal solution for designs where a high degree of heat transfer is required over large surface areas. According to the company, UniPhase 3500 is a silicone-free material that … [Read more...]
Liquid Silicone Adhesive Offers High Thermal Conductivity for Bonding Electronic Components
The Bergquist Company, a manufacturer of high-performance thermal management materials, has released Liqui-Bond SA 3505, a two-component, liquid silicone adhesive ideal for power supplies and discrete applications. With a high thermal conductivity of 3.5 W/m-K, Liqui-Bond SA 3505 offers a thermal conductivity previously unavailable in a structural adhesive, the company said. … [Read more...]
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