NMB Technologies Corporation has announced the availability of UV/Wet location-rated cooling fans for OEM applications. While the AC axial 4715HS Series and the 5915PC Series are already available potted, the new IP-rated UV/Wet location models have been certified to UL-507 for operation in a variety of environmental conditions, including water spray, humidity conditioning, … [Read more...]
World’s First Liquid-Cooled Smartphone Released
Japanese electronics maker Nippon Electronics Corporation (NEC) may have taken a step towards raising the current limit on smartphone processing capabilities with the company’s unveiling of the world’s first liquid-cooled smartphone earlier this month. While more effective cooling methods continue to be developed to combat larger heat loads in high-end computers, current … [Read more...]
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The use of flexible, cost-efficient microchips as a replacement for silicon chips, which are more expensive and difficult to make, is … [Read more...]
Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
Parker Hannifin Corporation, a developer of motion and control technologies, has released new two-phase evaporative liquid cooling systems for renewable energy power conversion systems. “The Parker system’s inherent cooling efficiency benefits can result total system cost reductions of up to 15 percent, and/or enable up to a 33 percent increase in converter rated capacity … [Read more...]
New Finned Ceramic Heat Sinks Released
AMEC Thermasol has introduced a new range of slim finned ceramic heat sinks to complement the company’s existing range of flat- and wave-type ceramic heat sinks. According to the company, the addition of fins to the heat sink provides a larger surface area and an increase in power rating compared to flat-type heat sinks. … [Read more...]
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