Written by: Dr. Amy Marconnet and Meghavin Bhatasana - Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at the component level. Continuous operation at high temperatures degrades … [Read more...]
Breaking Grounds with Generative Design for Two-phase Cooling of Electronic Devices
Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to the challenge, the fast-paced evolution of electronics means that the development time for the new cooler … [Read more...]
Thermal Management of Integrated Traction Drives in Electric Vehicles
This article reviews integration approaches and, by employing finite element analysis (FEA), compares thermal management solutions for the combined electric motor and power electronics systems for electric vehicles. Integration of power electronics into the electric motor helps achieve higher power densities in the electric traction drive systems. The benefit of integration … [Read more...]
Electric Motor Thermal Management for Green Transportation
Introduction Stringent greenhouse gas-emission legislations have accelerated the electrification of ground and air transportation. Since the electric motor is one of the core components of the electric drivetrain, improving its performance is a key enabler to better performance metrics of an electric drivetrain, i.e., higher power and torque density, better fuel economy (lower … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
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