A lawsuit filed earlier this month by liquid cooling solutions developer Asetek alleges that Cooler Master’s Seidon family of sealed-loop coolers introduced recently infringe upon patent No. 8,240,362 and patent No. 8,245,764 held by Asetek. Both patents reference a liquid-cooling system connected to a pump and radiator that is designed to be fully integrated into a single, … [Read more...]
Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic thermal interface pads provide “good softness and conformability to non-flat surfaces [and] excellent compressive stress … [Read more...]
Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
Heat Transfer at 'Any Temperature' Makes Thermal Interface Film Suitable for Cold Plate Applications
Thermal interface material developer AOS Thermal Compounds recently released Micro-Faze, a thermal interface film formulated with non-silicon thermal grease. According to AOS Thermal Compounds, Micro-Faze “requires minimum force to achieve total interface contact” and “Retains all the performance advantages of thermal grease . . . in the form of a thermal pad.” Suited for cold … [Read more...]
Low-Viscosity Thermally Conductive Silicone Compound
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
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