Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
Thermal management solutions provider Aavid Corp. has announced the acquisition of Republic of China fan design and manufacturing company NS Motor Technology. The acquisition brings a wide array of fans and blowers to Aavid Corp.’s thermal management solutions product line. “This latest addition to our capabilities and product offerings enhances our leadership position as the … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
New Customizable Heat Sinks for Use in High Power Environments and Resistors
Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power environments and the CP series of cold plate four-pass heat sinks for use with the company’s 1,000 and 2,000 watt TAP series of resistors. The new heat sinks will … [Read more...]
Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military Platforms
Authors Johannes van Es and Henk Jan van Gerner, National Aerospace Laboratory NLR, The Netherlands The next generation military platforms will be equipped with more and more powerful sensors and avionics. The increasing power densities in electronic subsystems demand more cooling power while survivability requirements limit the possibilities for extending or adding … [Read more...]
- « Previous Page
- 1
- …
- 170
- 171
- 172
- 173
- 174
- …
- 356
- Next Page »
