Omega Engineering Inc., a manufacturer of measurement and control instruments for a range of applications, has released thermal imaging camera kit model OSXL-A35SC for thermal benchtop testing applications. According to the company, the new thermal imaging camera kit features “plug-and-play” compatibility, fast data transfer, a wide temperature range and less than 50mK … [Read more...]
Experiment vs. Simulation, Part 3: JESD51-14
The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external … [Read more...]
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and … [Read more...]
New High Bay LED Cooler Is Smaller and Lighter Than Passive Cooling Equivalents
Nuventix, Inc. has introduced the LED Cooler R150-170, a new high bay LED cooler that, according to the company, is “33 percent smaller and 60 percent lighter than passive cooling equivalents used in industrial high bay fixtures.” The announcement was made at the Strategies in Light show held on February 12-14 in in Santa Clara, Calif. The R150-170 is capable of “exceptional … [Read more...]
“What Burns Me Up”: Follow Up to SEMI-THERM Executive Briefing
On Mar. 27, 2013, Roger Stout, P.E. of ON Semiconductor will present a live webinar, “SEMI-THERM Executive Briefing - "What Burns Me Up." Thermal errors, misconceptions and oversights occur on all levels; from semiconductor packaging, thermocouple theory, and infrared imaging; to cold fusion calorimetry and hot dense-plasma-focus fusion reactor design; to energy efficient … [Read more...]
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