Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The new method may have the potential to widen the use of thermoelectric devices. In cooperation with graduate student … [Read more...]
GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership
General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology is a new energy-efficient method for cooling consumer electronics that is based on technology used to … [Read more...]
Laser Cooling Method is “One Step Closer” to Smaller Medical Devices, “Self-Cooling” Computer Chips
Scientists from Nanyang Technological University (NTU) in Singapore have developed a new laser cooling method that could replace extreme refrigerant-based cooling systems in medical devices and satellite cameras and help develop futuristic computer chips capable of cooling themselves. If we are able to harness the power of laser cooling, it would mean that medical devices that … [Read more...]
New CPU Coolers Win 2013 CES Innovation Awards
Computer cooling product developer Zalman has introduced the new CNPS FX100 Cube fanless CPU cooler and CI Water Cooler. Both coolers received Innovations design and engineering awards at the 2013 Consumer Electronics Show in Las Vegas, Nev. and will be launched in the second quarter of 2013. According to the company, the new FX100 Cube fanless cooler is compatible with a … [Read more...]
Board-Level Heat Sinks for Semiconductor Devices in D2Pak, SOT-32, TO-220, and TO-263 Packages
Electronic components distributor Digi-Key has released the Assmann WSW line of board-level heat sinks for use in industrial process control equipment, telecommunications equipment, consumer products and automotive applications. According to the company, the heat sinks provide “optimal heat transfer,” due to “uniform pressure.” The new board-level heat sinks are available in … [Read more...]
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