Blogger Mike Schropp of “Total Geekdom” recently revealed the construction of his new wind tunnel-cooled computer. Designed for grid computing, Schropp’s new computer is part of the IBM’s World Community Grid, which combines a worldwide network of computers into a supercomputer that is working to identify cures for cancer and AIDS and find solutions to other areas of medical … [Read more...]
U.S. LED Lighting Manufacturer Develops Industry’s First Extruded Heat Sink “of its Kind”
A U.S. supplier and manufacturer of LED lighting, LED Waves, has announced that as of December 2012, the company’s LED high bay light will be equipped with “the only extruded heat sink of its kind on the market.” Typically, LED high bay manufacturers create heat sinks using an inexpensive die casting process that “limits the potential surface area of the heat sink to that of … [Read more...]
New Thermal Management “Centers of Excellence” Optimal for Heat Sink Production
Thermal management solutions company Sapa Extrusions North America has created two thermal management “centers of excellence” at the company’s Mountain Top, Pa. and City of Industry, Calif. locations. According to the company, the “center of excellence” designation is a new indicator within Sapa’s thermal management business unit that will provide “dedicated thermal management … [Read more...]
U.S. DoD Plans to Implement Hot Water Liquid Cooling System into Major Data Center
The U.S. Department of Defense (DoD) is planning to implement a liquid cooling systems into one of its major data centers. Developed by liquid cooling solutions company Asetek Inc., the direct-to-chip liquid cooling technology employs hot water and ambient air to cool servers. “Hot water direct-to-chip liquid-cooling is a powerful approach that can capture more than 80 percent … [Read more...]
Ultrathin “Nanoglue” Increases Heat Transfer Rate Across Metal-Ceramic Interface
Researchers at the Rensselaer Polytechnic Institute (RPI) in New York have developed a new method for increasing the heat transfer rate across two different materials. The team hopes that the study, titled “Bonding-Induced Thermal Conductance Enhancement at Inorganic Heterointerfaces Using Nanomolecular Monolayers,” will lead to new advances in cooling computer chips and LED … [Read more...]
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