U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil Ricketts began collaborating with researchers at the University of Liverpool to examine the use of porous metals for strength-to-weight ratio … [Read more...]
Research Suggests Ferroelectric Crystals May Assist with Computer Chip Heat Regulation
Researchers at the Carnegie Institution in Washington, D.C. have discovered a new, efficient way to extract heat using ferroelectric crystals. The crystal materials exhibit an electrical polarization in the absence of an electrical field that can be reversed by applying an external electrical field, resulting in a significant temperature change. Ronald Cohen, staff scientist … [Read more...]
CFD Software Seminar
December 3-4, 2012 in San Francisco, CA December 6-7, 2012 in Los Angeles, CA Cradle North America will be holding two training courses on scSTREAM in the San Francisco and Los Angeles area. According to the company, scSTREAM is one of the most popular Computational Fluid Dynamics software used in electronics industries in Japan. The main objective of the course is to enable … [Read more...]
Researchers Develop Possible New Heat Dissipation Method with Cold Plasma Treatment
Researchers from the College of Materials Science and Engineering at Beijing University of Chemical Technology in China have determined a new method for enhancing heat dissipation in microelectronics based on research on plasma-treated h-BN fillers. According to results published by Professor Yonglai Lu and Tui Ji, a master of engineering at the Center of Advanced Elastomer … [Read more...]
Choosing Adhesives for Withstanding Thermal Cycling Stresses
Many engineers have traditionally designed bonding applications to withstand extreme temperatures using the idea that substrate materials and adhesives with similar coefficients of thermal expansion (CTE) will, at a given temperature, change size at the same rate. However, the difficulty of finding substrates and adhesives that have compatible CTEs and meet all application … [Read more...]
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