Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master's OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers. Horizontal Vapor Chambers spread heat eight times faster than solid copper, eliminating hot … [Read more...]
New Heatsink Supports More Package Sizes
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, the heat sink … [Read more...]
Carbon Fiber Sheet Prototype Challenges Thermal Grease
Sony Chemical & Information Device Corp. displayed a prototype of a sheet whose thermal conductivity it claims is equivalent to that of thermal grease and has a longer life span. The sheet, known as EX20000C, uses a combination of silicon and carbon fibers to produce a thermal conductive layer that is between 0.3 and 2mm thick and has a thermal resistance rating of … [Read more...]
New Thermally Conductive Silicone Thermal Interface Material
NuSil Technology LLC presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. EPM1-2493 does not have the typical paste-like … [Read more...]
3200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to the 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes … [Read more...]
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