Murata Americas announced the launch of a microblower that uses a piezoelectric diaphragm, which vibrates up and down when a sine wave voltage is applied. The vibrations force air into the microblower and out through a nozzle on the top of the device. Used as an air pump and capable of creating a high air pressure flow, the pump is ideally suited to shorten the duration … [Read more...]
Improved Thermal Management in Power Semiconductors with LL Packages
StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and … [Read more...]
Liquid Dispensed Thermal Interface Material Filler
The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for flexibility in component orientation during assembly. As cured, the soft elastomer provides a … [Read more...]
Hot-Water Cooled Supercomputer
The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than air-cooled systems using a new form of IBM’s hot-water cooling technology. It cools active components in the system such as processors and memory modules … [Read more...]
Spray Cooling Heat Transfer – Test and CFD Analysis
Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances, yielding significant reduction in overall thermal resistance. Due to the complexity and chaotic nature of millions of … [Read more...]
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