Abstract Data centers face challenges in balancing space and power, with studies showing that when power density exceeds 7kW per rack, IT equipment space utilization drops to 50%. Traditional cooling methods are reaching limits due to increasing demands from deep learning and AI, necessitating more space. Two-phase immersion cooling offers simplicity and cost savings … [Read more...]
Thermocouple Transient Behavior
Previous articles in this series described how thermocouple wire size [1] and thermocouple attachment method [2] can affect steady state temperature measurements. This article briefly discusses how these factors can affect the transient response of thermocouples when used to monitor temperatures that change value over time. Bare Thermocouple Junction Before addressing … [Read more...]
Tech Brief: Thermocouple Attachment
The previous article in this series on thermocouples described how the size of the thermocouple wire could affect its accuracy [1]. This is particularly true if the wire is exposed to high convection coefficients. This article addresses a separate issue, namely the degree to which the attachment method impacts thermocouple readings. As it turns out, once again the … [Read more...]
Thermal Analysis Methodology Best Practices
Thermal analysis: It’s a field that every mechanical engineer is exposed to during their undergraduate studies and many dabble in at some point during their professional careers. It’s also a field that some devote their full-time careers to as dedicated thermal engineers (or thermal analysts). Regardless of where in the broad spectrum of mechanical engineering work scope you … [Read more...]
Design Considerations for Chip/Package Level Bare Die Impingement Cooling for High Performance Computation Systems
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
